3Dresyn NSEK1 is our Non Soluble EK 3D resin for
custom design of 2D/3D printing conductive resins for electronics e.g. antennas for IoT applications (HF, UHF), RFID and NFC tags, OLED, OPVs, flexible PCBs, flexible cables, etc... It is an alcohol / water soluble and swellable 3D resin binder, which is compatible with our conductive additives, dispersants, and anti-sedimentation additives.
Features of 3Dresyn NSEK:
- 3Dresyn NSEK1 (non water soluble) and 3Dresyn SEK1 (water soluble) can be blended adjust water resistance and solubility
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water solubility and water resistance can be custom adjusted with Soluble & Swellable 3Dresyn SEK1
- excellent compatibility with most conductive nano and micronised conductive powders and nanowires
- clear finishing
- ultra hard: Shore Hardness D80-85
- tensile and flexural strength <40 MPa
- high rigidity (Young modulus >2500 MPa)
- elongation <2%
- very low viscosity, below 100 cps
- excellent printability with most SLA, DLP and LCD printers
