3Dresyn IM-HDT-WS High-Temperature Water-Soluble Sacrificial Resin

Product description

3Dresyn® IM-HDT-WS is a water-soluble sacrificial mold-making photopolymer developed for the fabrication of single-use molds for advanced injection and casting processes, including polymers, composites, ceramics (CIM) and metals (MIM), under elevated pressure and temperature conditions.

Application framework

Designed for use in vat photopolymerization systems (SLA, DLP and LCD) within controlled professional environments. Suitable for the fabrication of water-soluble sacrificial molds for advanced molding and casting workflows requiring high rigidity, dimensional stability and controlled dissolution behavior. This material is intended for single-use applications where the mold is removed by dissolution after processing.

Typical applications

• Water-soluble sacrificial molds for injection and casting processes
• Single-use molds for thermoplastic injection (short-run and prototyping workflows)
• Molds for composite processing and resin transfer / casting systems
• Molds for ceramic injection molding (CIM)
• Molds for metal injection molding (MIM)
• Thin-wall sacrificial molds requiring high rigidity and fast dissolution

Measured mechanical properties

• Shore hardness: D85 (ISO 868)
• Heat deflection temperature (HDT): <160 °C @ 0.45 MPa (ISO 75)
• Tensile and flexural strength: <40 MPa (ISO 527 / ISO 178)
• Young’s modulus: >3000 MPa (ISO 527)
• Elongation: <2% (ISO 527)
• Viscosity: <100 mPas at 23°C ± 2°C (ISO 3219)

Functional performance characteristics

• Fast solubility in water for efficient mold removal after processing
• Tack-free finishes after light box post-curing
• Very high rigidity enabling thin-wall mold fabrication for reduced material usage and faster dissolution
• Non-brittle behavior at typical injection and casting process temperatures
• High resolution once tuned to printer specifications and after full workflow implementation
• Very low shrinkage and high dimensional stability

Processing and handling performance

• Printable with most commercial and professional SLA, DLP and LCD 3D printers
• Cyan version is recommended for increased dimensional accuracy vs clear version
  
• Improved water solubility is achieved with low light power printers, such as standard LCD printers
• Increased durability of the resin tank
• Metal- and organo-tin free formulation
• It can crystallise at temperatures below 15–20 °C
• Warm to 60°C to dissolve crystals before use
• Recommended printing temperature: 20–25 °C
• Clean and post-cure 3D prints with Cleaning Fluid WS1 Bio
• Level of printing difficulty: medium

Processing note

Soluble materials may swell instead of dissolve in some printing settings, especially when they are cured at high relative power such as with high power laser and DLP printers.

Testing & processing disclaimer

Material performance depends on printer type, exposure conditions, mold geometry, injected or cast material, processing temperature and pressure, dissolution conditions and full workflow implementation. Parameters must be validated by the user for each specific application.

Why choose 3Dresyn® IM-HDT-WS

• Water-soluble sacrificial mold material for advanced injection and casting workflows
• Designed for single-use mold fabrication with controlled post-process removal
• Very high rigidity for thin-wall mold geometries
• Suitable for CIM, MIM and selected polymer and composite processing workflows
• Fast and efficient dissolution in water
• Very low shrinkage and high dimensional stability
• Broad compatibility with SLA/DLP/LCD printers
• Metal- and organo-tin free formulation

Regulatory & legal notice

This material is supplied as a professional manufacturing material and is not marketed as a finished product. It is intended for use as a sacrificial tooling material. Final molding or casting performance, dissolution behavior and process validation remain the responsibility of the user depending on printer, mold design and processing workflow.

Document reference: TDS-IM-HDT-WS-EN | Version: 1.0 | Last updated: March 2026